Method for coloring circuit layout and system for performing the same

ABSTRACT

Implementations of the present disclosure provide coloring methods that sort and pre-color nodes of G0-linked networks in a multiple-patterning technology (MPT)-compliant layout design by coordinate. In one embodiment, a method includes identifying target networks in a circuit layout, each target network having two or more linked nodes representing circuit patterns, and each target network being presented in an imaginary X-Y coordinate plane, assigning a first feature to a first node in each target network, the first node is determined using a coordinate-based method, and assigning the first feature and a second feature to remaining nodes in each target network in an alternating manner so that any two immediately adjacent linked nodes in each target network have different features.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.17/853,758 filed Jun. 29, 2022, which is a divisional of U.S. patentapplication Ser. No. 17/063,429 filed Oct. 5, 2020, now U.S. Pat. No.11,392,742, which is a continuation of U.S. patent application Ser. No.16/660,506 filed Oct. 22, 2019, now U.S. Pat. No. 10,796,055, which is acontinuation application of U.S. patent application Ser. No. 15/718,522filed Sep. 28, 2017, now U.S. Pat. No. 10,509,881, the entire disclosureof each of which is incorporated herein by reference.

BACKGROUND

Integrated chips are made by a process that includes a design step and asubsequent fabrication step. During the design step, a layout of anintegrated chip (IC) is generated as an electronic file. The layoutincludes geometric shapes corresponding to structures to be fabricatedon-chip. During the fabrication step, the layout is formed onto asemiconductor workpiece.

The resolution that a conventional lithography tool can achieve islimited to 45 nanometer (nm) half pitch. To continue to use existinglithography tools to resolve smaller spaces, double patterning methodshave been developed. Double patterning method involves splitting (e.g.,dividing or separating) a target circuit pattern into two separatepatterns. The two separate patterns are then formed separately on asingle layer of a substrate using two separate masks in succession. Bybreaking a layout into multiple different masks, a minimum line spacingin the combined pattern is reduced while maintaining good resolution.

To use double patterning methods, a target circuit pattern must bedouble-patterning compliant, which means the target circuit pattern iscapable of being decomposed into two separate patterns that each may beformed in a single layer of photoresist using the conventionallithography tool. For ease of visualization, patterns assigned to thesame or different masks for exposing the same layer are often drawn indifferent colors. It has been observed that this color-assigningprocedure can be problematic. For example, during the decompositionprocess of a circuit pattern, a first mask for forming a firstdecomposed pattern may be randomly represented as a first color (e.g.,black color) in an electronic design automation (EDA) layout tool, and asecond mask for forming a second decomposed pattern may be representedas a second, different color (e.g., gray color) in the circuit designtool. However, in the next decomposition process of the same circuitpattern, a first mask for forming the first decomposed pattern may berandomly represented as a second color (e.g., gray color) in the circuitdesign tool while a second mask for forming the second decomposedpattern may be represented as a first color (e.g., black color) in theEDA layout tool. In other words, the EDA layout tool may generatedifferent coloring results (i.e., different photomask assignments) fromtime to time even though the same circuit pattern is analyzed.

Coloring results may differ from chip to chip due to design change ordifferent database hierarchy adapted by different clients/chipdesigners. Coloring results may also differ from location to locationwithin the same chip for the same reasons. Inconsistencies in coloringresults can cause uncertainties in the manufacture of semiconductordevices.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1A-1D depict four different coloring results in a portion of alayout having six circuit patterns after color assignment.

FIGS. 2A and 2B depict a portion of a DPT-compliant layout design beforeand after the application of a coloring method according to oneimplementation of the present disclosure.

FIG. 3 depicts a flowchart illustrating exemplary coloring methodaccording to implementations of the present disclosure.

FIGS. 4A-4D depict a portion of a DPT-compliant circuit layout for anintegrated chip 1 at different stages according to the flowchart of FIG.3 .

FIGS. 5A-5D depict a portion of a DPT-compliant circuit layout for anintegrated chip 2 at different stages according to the flowchart of FIG.3 .

FIG. 6 depicts a region of an exemplary circuit layout showing aplurality of G0-linked networks that have been colored according tocoloring methods of the present disclosure.

FIG. 7A depicts a region of a circuit layout having G0-linked networksmatched the region of FIG. 6 .

FIG. 7B depicts the G0-linked networks have been colored after thephotomask assignment.

FIG. 8 depicts a system that may be used to practice variousimplementations of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

This disclosure provides novel coloring methods for regulating DPT(Double-Patterning Technology)-compliant layout in electronic designautomation (EDA) layout tools so that all or target G0-linked networks,after decomposition process, are sorted and designated with colors thatfollow a pre-determined coloring method. The coloring results ofG0-linked networks are consistent from chip to chip or location tolocation within the same chip. The unique coloring results associatedwith G0-linked networks can be stored in the system and used as afingerprint for identifying and assigning photomasks for identical orrecurring G0-linked networks. It should be understood that variousexamples relating to DPT are discussed in this disclosure for ease ofexplaining the concepts. The methods and concepts of this disclosure canbe applied to triple-patterning technology (TPT) or multiple-patterningtechnology (MPT) having greater number of photomasks.

A DPT mask assignment method generally includes: (1) identifying whethera layout has a native DPT conflict that prevents decomposition of thelayout into the pre-determined number of photomasks to be used; (2)modifying the layout, if necessary, to eliminate the DPT conflicts; and(3) assigning the circuit patterns in the layout to the predeterminednumber of photomasks. As described below, step (1) can be achievedsystematically for DPT using two or more photomasks to pattern a singlelayer.

FIG. 1A shows a portion of a layout 100 having six circuit patterns 102,104, 106, 108, 110, and 112. The initial layout may be generated by aplace and route tool. The layout can be in computer aided design format(e.g., GDSII), chip design, or retrieved from a design database. In someimplementations, the layout includes all of the circuit patterns on alayer of an IC. In other implementations, the layout includes a subsetof the circuit patterns within a region of the layer of the IC. Circuitpatterns can be interconnect (line layer) patterns in a back end of line(BEOL) interconnect layer, or active device (front end of line) layerpatterns. For example, circuit patterns may be any features such as“lines,” “blocks,” “vias,” “openings,” “holes,” “channels,” “recesses,”“plugs,” etc., that are suitable for providing a contact path which mayextend horizontally and/or vertically within a structure.

A graph representing the circuit patterns is shown overlaid on thelayout. The graph includes four nodes 114, 116, 118, 120, 122, and 124representing the circuit patterns 102, 104, 106, 108, 110, and 112,respectively. Although reference is made to nodes below, it isunderstood that the nodes are lumped representations of the circuitpatterns. The nodes are convenient for diagramming and for the purposeof analyzing and assigning the circuit patterns to various photomasksusing EDA layout tools. Therefore, the nodes can be in any form ofpolygons.

For a given IC technology (e.g., 65 nm, 45 nm, 28 nm, or the like), arespective minimum separation distance (abbreviated as G0) is defined,such that two patterns closer to each other than the G0 distance cannotbe patterned with good resolution using a single photomask and exposure.Any two nodes which are separated by a distance less than the minimumseparation distance is indicated by a link (referred to herein as“G0-space”), meaning patterns associated with these nodes are too closeto be in the same photomask. In the graph of FIG. 1A, the distancesbetween nodes 114 and 116, nodes 116 and 118, nodes 118 and 120, andnodes 122 and 124 are less than the minimum separation distance andtherefore are indicated by a link 126, 128, 130, and 132, respectively.FIG. 1A shows the nodes 114, 116, 118 and 120 are linked together toform a network, which is referred to herein as “G0-linked network 1”.Likewise, nodes 122 and 124 are linked together to form another network,which is referred to herein as “G0-linked network 2”.

Suitable software, such as a design rule checker (DRC) software, may beused to systematically check a layout design and show all G0-linkednetworks or G0-spaces in the layout design. An EDA layout tool or anysuitable automated tool then uses this information to pre-color one ormore nodes in the layout design, so that the patterns associated withpre-colored nodes are formed by the same photomask. For example, in thelayout 100 of FIG. 1A, nodes 114 and 124 may be pre-colored to a firstcolor (e.g., color black) that corresponds to a first photomask. Afterpre-coloring, a decomposition algorithm will assign colors to nodes 116,118, 120, and 122 in an alternating manner so that any two immediatelyadjacent linked nodes are assigned with different colors. That is, node118 will be assigned with the first color (color black) while nodes 116,120, and 122 are assigned with a second color (e.g., color gray) thatcorresponds to a second photomask. With this set of assignments, thepatterns formed during each of exposure steps can be patterned clearly.If a circuit pattern in a layout can be decomposed and assigned to twodifferent photomasks so that within each of the photomasks, no pair ofadjacent patterns are closer to each other than the minimum separationdistance, then the layout is double-patterning technology (DPT)compliant. Similarly, if a circuit pattern in a layout can be decomposedand assigned to N different photomasks (N>2) so such a way that witheach of the photomasks, no pair of adjacent patterns are closer to eachother than the minimum separation distance, then the layout ismulti-patterning technology (MPT) compliant.

It has been observed that while most circuit patterns in a DPT-compliantlayout may be separated into two photomasks, the EDA layout tool mayassign different colors to the same nodes from time to time atpre-coloring stage, resulting in various coloring combinations afterdecomposition of the circuit patterns. For example, for the layout 100of FIG. 1A, the EDA layout tool may assign nodes 114 and 124 with afirst color (e.g., color black), nodes 114 and 124 with a second color(e.g., color gray), nodes 114 and 122 with a first color (e.g., colorblack), or nodes 114 and 122 with a second color (e.g., color gray). Adecomposition algorithm will then assign colors to nodes between thepre-colored nodes in an alternating manner, resulting in a total of fourdifferent coloring results (or so-called solutions) as shown in FIGS.1A-1D. As discussed previously, coloring results may differ from chip tochip due to design change or different database hierarchy adapted bydifferent clients/chip designers. Coloring results may also differ fromlocation to location within the same chip for the same reasons. In otherwords, the EDA layout tool may generate four different coloring results(i.e., solutions) even though the very same G0-linked networks areanalyzed.

Different coloring results can cause a specific node (pattern) to beheated differently in various environments. For example, for thesolution shown in FIG. 1B, the nodes 116, 120 and 124 are assigned witha second color (e.g., color gray), meaning the circuit patterns 104,108, and 112 are formed by a second photomask. When the circuit patterns104, 108, and 112 are formed first in a layer or a region of the layerof an IC, no other circuit patterns are present on the layer or theregion of the layer of the IC because the circuit patterns 102, 106 and110 are yet to be formed by a first photomask. The node 124 of theG0-linked network 2 can “see” the nodes 116 and 120 in the layer or theregion of the layer of the IC. Particularly, the node 124 sees the node120 that is in close proximity to the node 124. In this situation, thenode 124 of the G0-linked network 2 in FIG. 1B is referred to as in a“Mask B dense” environment.

Similarly, for the solution shown in FIG. 1C, the nodes 116, 120 and 124are assigned with a first color (e.g., color black), meaning the circuitpatterns 104, 108, and 112 are formed by a first photomask. When thecircuit patterns 104, 108, and 112 are formed first in a layer or aregion of the layer of an IC, no other circuit patterns are present onthe layer or the region of the layer of the IC because the circuitpatterns 102, 106 and 110 are yet to be formed by a second photomask.The node 124 of the G0-linked network 2 can “see” the nodes 116 and 120in the layer or the region of the layer of the IC. Particularly, thenode 124 sees the node 120 that is in close proximity to the node 124.In this situation, the node 124 of the G0-linked network 2 in FIG. 1C isreferred to as in a “Mask A dense” environment.

On the other hand, for the solution shown in FIG. 1A, the nodes 114, 118and 124 are assigned with a first color (e.g., color black), meaning thecircuit patterns 102, 106, and 112 are formed by a first photomask. Whenthe circuit patterns 102, 106, and 112 are formed first in a layer or aregion of the layer of an IC, no other circuit patterns are present onthe layer or the region of the layer of the IC because the circuitpatterns 104, 108 and 110 are yet to be formed by a second photomask.For node 124 of the G0-linked network 2, it does not “see” other nodesin the layer or the region of the layer of the IC but the nodes 114 and118 that are also formed by the first photomask. Particularly, the node124 does not see the node 120, which would otherwise have been seen ifit was in a “Mask A dense” environment. In this situation, the node 124of the G0-linked network 2 in FIG. 1A is referred to as in a “Mask Aisolated” environment.

Likewise, for the solution shown in FIG. 1D, the nodes 114, 118 and 124are assigned with a second color (e.g., color gray), meaning the circuitpatterns 102, 106, and 112 are formed by a second photomask. When thecircuit patterns 102, 106, and 112 are formed first in a layer or aregion of the layer of an IC, no other circuit patterns are present onthe layer or the region of the layer of the IC because the circuitpatterns 104, 108 and 110 are yet to be formed by a first photomask. Fornode 124 of the G0-linked network 2, it does not “see” other nodes inthe layer or the region of the layer of the IC but the nodes 114 and 118that are also formed by the second photomask. Particularly, the node 124does not see the node 120, which would otherwise have been seen if itwas in a “Mask B dense” environment. In this situation, the node 124 ofthe G0-linked network 2 in FIG. 1D is referred to as in a “Mask Bisolated” environment.

As can be seen in FIGS. 1A-1D, the node 124 of the G0-linked network 2could be in four different environments (i.e., “Mask A isolated”, “MaskB isolated”, “Mask A dense”, and “Mask B dense”) due to differentcoloring results created during the decomposition process. Node 122 ofthe G0-linked network 2 and other nodes of the G0-linked network 1 couldalso be in isolated and/or dense environments for the same reason.Process conditions for formation of the circuit patterns may vary indifferent environments. For example, when the node 124 of the G0-linkednetwork 2 is in a “Mask A dense” environment as shown in FIG. 1C, theamount of an etchant used to form the pattern 112 (e.g., a via) may bedifferent from the amount used in the situation if the node 124 of theG0-linked network 2 was in a “Mask A isolated” environment shown in FIG.1A, because the node 120 is formed by the same photomask as the node 124and is in close proximity to the node 124 (i.e., node 124 sees node120). In such a case, the amount of the etchant used in forming thepatterns 108 and 112 may be relatively less as compared to the amountused in forming the pattern 112 in a “Mask A isolated” environment(i.e., node 124 does not see node 120), considering both pattern 112 andpattern 108 are simultaneously formed in a close neighborhood. Not onlythe etchant amount may vary for each node in different environments, theetchant receipt used in forming a specific node may also be changed fromtime to time because that specific node could be assigned to a differentcolor (different photomask) due to design change or different databaseadapted by different clients/chip designers.

Different coloring combinations can lead to various changes in theprocess receipts during lithography and uncertainties in the manufactureof semiconductor devices since every node in each G0-linked networkcould be in various environments due to inconsistencies in coloringresults during the decomposition process. However, the processlimitations (e.g., lithography, etching, or CMP etc.) in advanced nodescannot tolerate unexpected coloring combinations in critical points orhotspots, which may include process weakness regions formed as a resultof bridging or shrinkage of the critical dimension that may have greatpossibility to incur defects. These issues get worse especially when thenumber of G0-linked networks in the target area increases.

Exemplary coloring methods of the present disclosure can be applied to aDPT-compliant layout (i.e., the circuit patterns in the layout can beseparated into two photomask and is thus 2-colorable), to avoid processissues due to inconsistencies in coloring results. FIGS. 2A and 2Bdepict a portion of a DPT-compliant layout design 200 before and afterthe application of a coloring method according to one implementation ofthe present disclosure. In FIG. 2A, three G0-linked networks 202, 204,and 206 (“target networks”) in the DPT-compliant, layout design 200 havebeen identified by a software, such as a design rule checker (DRC)software. It is understood that three G0-linked networks are shown herefor illustration purposes. The DPT-compliant layout design 200 may haveother G0-linked networks. In addition, implementations of the presentdisclosure are applicable to multiple-patterning technology(MPT)-compliant layout designs.

Each G0-linked network 202, 204, 206 shown in FIG. 2A includes three ormore nodes. For example, G0-linked network 202 has nodes 202 a, 202 b,202 c, G0-linked network 204 has nodes 204 a, 204 b, 204 c, andG0-linked network 206 has nodes 206 a, 206 b, 206 c, 206 d. As discussedpreviously, the nodes are representations of the circuit patterns, whichmay be interconnect (line layer) patterns in a back end of line (BEOL)interconnect layer, or active device (front end of line) layer patterns.The nodes in each G0-linked network 202, 204, 206 are linked together asthey are separated by a distance less than a minimum separation distance(i.e., G0-space) for a given IC technology (e.g., 45 nm, 20 nm, 16 nm,or the like). For 193 nm lithography, the minimum separation distancemay be about 70 nm to about 120 nm, for example about 100 nm.

After the G0-linked networks 202, 204, and 206 have been identified, thecoloring method is performed to pre-color the node in each G0-linkednetwork. The coloring method may be performed by an EDA layout tool orany suitable automated tool. In one implementation, the coloring methodis a coordinate-based coloring method which sorts and pre-colors thenode in each G0-linked network 202, 204, 206 by coordinate. For example,the DPT-compliant layout design 200 having all G0-linked networks orG0-linked networks of interest (e.g., G0-linked networks 202, 204, 206)can be presented in an imaginary X-Y coordinate plane in the EDA layouttool. Therefore, the nodes in each G0-linked network are presented inthe imaginary X-Y coordinate plane. In one implementation, the node ineach G0-linked network that is closest to the Y-axis (i.e., the nodehaving the lowest X coordinate) will be designated with a first color(color 1) by the EDA layout tool. If two or more nodes in the G0-linkednetwork are found to have the same X coordinate, then the node that isclosest to the X-axis (i.e. the node having the lowest Y coordinate)will be designated with the first color. In other words, the node ineach G0-linked network that has the lowest X coordinate and the lowest Ycoordinate will be assigned with the first color.

For instance, in the implementation shown in FIG. 2A, the G0-linkednetwork 202 has three nodes 202 a, 202 b, 202 c. Node 202 a hascoordinates (x1, y6) and note 202 b has coordinates (x1, y4). Althoughnode 202 a and node 202 b have the same X coordinate, node 202 b will bedesignated with the first color because it is closer to the X axis.Similarly, the G0-linked network 204 has three nodes 204 a, 204 b, 204c, and the node 204 a, with coordinates (x4, y9), will be designatedwith the first color because it is closest to the Y-axis than nodes 204b (x6, y9) and nodes 204 c (x5, y7). The G0-linked network 206 has fournodes 206 a, 206 b, 206 c, 206 d, and the node 206 c, with coordinates(x6, y3), will be designated with the first color because it is the oneclosest to the Y-axis than nodes 206 a (x9, y7), node 206 b (x8, y5),and node 206 d (x8, y1).

After the first node in each G0-linked network has been designated withthe first color, the EDA layout tool will perform a decompositionalgorithm to assign first and second colors to the rest of the nodes ineach G0-linked network in an alternating manner so that any twoimmediately adjacent linked nodes in each G0-linked network aredesignated with different colors. For example, in the implementationshown in FIG. 2A, the node 202 b of the G0-linked network 202 has beendesignated with the first color, so the nodes 202 a and 202 c will bedesignated with a second color (color 2), as shown in FIG. 2B.Similarly, the node 204 a of the G0-linked network 204 has beendesignated with the first color, so the node 204 c will be designatedwith the second color while the node 204 b will be designated with thefirst color, as shown in FIG. 2B. Likewise, the node 206 c of theG0-linked network 206 has been designated with the first color, so thenodes 206 b, and 206 d will be designated with the second color and thenode 206 a will be designated with the first color, as shown in FIG. 2B.

Once all the nodes in each G0-linked network have been colored, aphotomask assignment procedure is performed. For example, nodes that aredesignated with color 1 will be assigned to a first photomask whilenodes that are designated with color 2 will be assigned to a secondphotomask, or vice versa.

It should be noted that while coloring methods discussed hereindesignating color to the node in each G0-linked network based on the“lowest X coordinate first then lowest Y coordinate” rule (i.e., thenode having lowest X coordinate and lowest Y coordinate), the concept ofthe present disclosure is equally applicable to the “lowest X coordinatefirst then largest Y coordinate” rule (i.e., the node having lowest Xcoordinate and largest Y coordinate), the “largest X coordinate firstthen lowest Y coordinate” rule (i.e., the node having largest Xcoordinate and lowest Y coordinate), or “largest X coordinate first thenlargest Y coordinate” rule (i.e., the node having largest X coordinateand largest Y coordinate). Other rules may also be used as long as aconsistent rule is applied to all G0-linked networks in a DPT-compliantlayout design. In addition, while the term “color” is discussed in thisdisclosure, it is contemplated that color can be replaced by anysuitable distinctive features such as shapes, numbers, icons, symbols,or the like.

For those non DPT-compliant layout designs, e.g., the total number ofG0-spaces violating the minimum spacing requirements is an odd number(i.e., an odd-cycle loop), the layout design will need to be changedbefore the coloring method can be applied. In such a case, the layoutdesign needs to be changed so that G0-spaces form an even-cycle loop,meaning the circuit patterns can be separated into two photomasks and is2-colorable. A loop is where the G0-spaces among nodes (or polygons)form a cyclic sequence.

FIG. 3 depicts a flowchart illustrating exemplary coloring method 300according to implementations of the present disclosure. FIGS. 4A-4Ddepict a portion of a DPT-compliant circuit layout 400 for an integratedchip 1 at different stages according to the flowchart of FIG. 3 .Although various operations are illustrated in the drawings anddescribed herein, no limitation regarding the order of such steps or thepresence or absence of intervening steps is implied. Operations depictedor described as sequential are, unless explicitly specified, merely doneso for purposes of explanation without precluding the possibility thatthe respective steps are actually performed in concurrent or overlappingmanner, at least partially if not entirely.

The coloring method 300 starts at operation 302 where a circuit layout,such as the circuit layout 400 shown in FIG. 4A, is received. Theinitial circuit layout 400 may be generated by a place and route tool.The circuit layout can be in computer aided design format (e.g., GDSII),chip design, or retrieved from a design database. The circuit layout 400has a plurality of nodes 402-413 representing the circuit patterns. Insome implementations, the nodes 402-413 represent the circuit patternsin a single layer of the IC. The nodes 402-413 can be in any form ofpolygons. Circuit patterns can be interconnect (line layer) patterns ina back end of line (BEOL) interconnect layer, or active device (frontend of line) layer patterns. In one implementation, the circuit layout400 may include all of the circuit patterns on a layer of an IC. In oneimplementation, the circuit layout may include a subset of the circuitpatterns within a region of the layer of the IC.

At operation 304, the circuit layout 400 is checked to identify allG0-linked networks (“target networks”) having a G0-space according todesign rules, for example a spacing rule. A design rule checker (DRC)software or any suitable software may be used to systematically checkdesign rules to show all G0-linked networks or G0-spaces in the circuitlayout 400. As discussed before, G0-space refers to nodes beingseparated by a distance less than a minimum separation distance for agiven IC technology (e.g., 45 nm, 20 nm, 16 nm, or the like). For 193 nmlithography, the minimum separation distance may be about 70 nm to about120 nm, for example about 100 nm. FIG. 4B shows four G0-linked networks414, 416, 418, 420 have been identified.

At operation 306, each G0-linked networks 414, 416, 418, 420 issubjected to a coordinate-based coloring method as discussed above withrespect to FIGS. 2A and 2B. As discussed previously, thecoordinate-based coloring method is performed by an EDA layout tool orany suitable automated tool to sort and pre-color the node in eachG0-linked network 414, 416, 418, 420 so that the node in each G0-linkednetwork that is closest to the Y-axis (i.e., the node having the lowestX coordinate) is designated with a first color (color 1). If two or morenodes in the G0-linked network have the same X coordinate, then the nodeof that two or more nodes that is closest to the X-axis (i.e., the nodehaving the lowest. Y coordinate) will be designated with the firstcolor. In other words, the node in each G0-linked network that has thelowest X coordinate and the lowest Y coordinate will be assigned withthe first color. FIG. 4C shows each G0-linked network 414, 416, 418, 420have been sorted and pre-colored using the coordinate-based coloringmethod. In the implementation of FIG. 4C, the node 402 of the G0-linkednetwork 414, the node 406 of the G0-linked network 416, the node 408 ofthe G0-linked network 418 and the node 412 of the G0-linked network 420have been designated with a first color (color 1).

At operation 308, after the node in each G0-linked network 414, 416,418, 420 have been pre-colored, a decomposition algorithm is performedby the EDA tool to assign colors to the rest of the nodes in eachG0-linked network 414, 416, 418, 420 in an alternating manner so thatany two immediately adjacent nodes in each G0-linked network 414, 416,418, 420 have colors that are different from each other. FIG. 4D showsthe color designation of the G0-linked network 414, 416, 418, 420 afterthe decomposition process where the nodes 403 and 405 of the G0-linkednetwork 414 are designated with a second color (color 2) and the node404 is designated with the first color; the node 407 of the G0-linkednetwork 416 is designated with the second color; the nodes 409 and 411of the G0-linked network 418 are designated with the second color andthe node 410 is designated with the first color; and the node 413 of theG0-linked network 420 is designated with the second color.

At operation 310, once all the nodes in each G0-linked network have beencolored, a photomask assignment procedure is performed. For example,nodes (e.g., nodes 402, 404, 406, 408, 410, 412) in each G0-linkednetworks 414, 416, 418, 420 that are designated with color 1 will beassigned to a first photomask while nodes (e.g., nodes 403, 405, 407,409, 411, 413) that are designated with color 2 will be assigned to asecond photomask, or vice versa. The photomask assignment data is thenoutputted to a readable storage medium for use by a lithography process.

At operation 312, once the photomask assignment procedure is done, alithography process is performed to pattern a semiconductor substrateusing the assigned photomasks.

FIGS. 5A-5D depict a portion of a DPT-compliant circuit layout 500 foran integrated chip 2 at different stages according to the flowchart ofFIG. 3 . Similarly to FIGS. 4A-4D, the circuit layout 500 as receivedhas a plurality of nodes 502-507 representing the circuit patterns, asshown in FIG. 5A. The nodes 502-507 have substantially identicalarrangements to the nodes 402-413 of FIG. 4A. The circuit layout 500 issystematically checked to identify all G0-linked networks having aG0-space according to design rules, for example a spacing rule. FIG. 5Bshows two G0-linked networks 514 and 516 have been identified. EachG0-linked networks 514, 516 is then subjected to a coordinate-basedcoloring method as discussed above with respect to FIGS. 2A and 2B. FIG.5C shows each G0-linked network 514, 516 have been sorted andpre-colored using the coordinate-based coloring method. In theimplementation of FIG. 5C, the node 502 of the G0-linked network 514 andthe node 506 of the G0-linked network 516 have been designated with afirst color (color 1).

After the node in each G0-linked network 514, 516 have been pre-colored,a decomposition algorithm is performed to assign colors to the rest ofthe nodes in each G0-linked network 514, 516 in an alternating manner sothat any two immediately adjacent linked nodes in each G0-linked network514, 516 are designated with colors that are different from each other.FIG. 5D shows the color designation of the G0-linked network 514, 516after the decomposition process where the nodes 503 and 505 of theG0-linked network 514 are designated with a second color (color 2) andthe node 504 is designated with the first color, and the node 507 of theG0-linked network 516 is designated with the second color.

Once all the nodes in each G0-linked network 514, 516 have been colored,a photomask assignment procedure is performed. For example, nodes (e.g.,nodes 502, 504, 506) in each G0-linked networks 514, 516 that aredesignated with color 1 will be assigned to a first photomask whilenodes (e.g., nodes 503, 505, 507) that are designated with color 2 willbe assigned to a second photomask, or vice versa.

The coloring results shown in FIGS. 4D and 5D prove that identical orsimilar G0-linked networks will have the same coloring results/sequenceeven if they are from different circuit layouts 400, 500 and aredesigned for different integrated chips. In other words, all G0-linkednetworks in one or more DPT-compliant layout designs will haveconsistent coloring results/combinations no matter what database isadapted by clients/chip designers, or how many design changes have beenmade or are going to be made in the layout design. As a result,uncertainties in the manufacture of semiconductor devices can be avoidedregardless of whether nodes in G0-linked network are in dense orisolated environment.

In addition, since coloring results of each G0-linked network in aDPT-compliant layout design is predictable and consistent from locationto location or from chip to chip, such coloring uniqueness can be usedto construct a coloring fingerprint database for instant assignment ofphotomasks for recurring G0-linked networks. For example, the uniquearrangement of the G0-linked networks 414, 416, 418, 420 shown in FIG.4D can be stored as fingerprint regions in a non-transitory machinereadable storage medium for use in a photomask assignment process. AnEDA tool, a pattern-matching tool, or any suitable pattern-recognitiontool can then be used to search/analyze shapes in any IC layout design.If the EDA tool or the pattern-matching tool finds G0-linked networkshaving an arrangement identical or substantially similar to theG0-linked networks 414, 416, 418, 420 stored in the machine readablestorage medium, a unique coloring combination (i.e., photomaskassignment) associated with the G0-linked networks 414, 416, 418, 420will automatically or manually be assigned to that new G0-linkednetworks. In this way, the pattern which matches the fingerprint regionswill be assigned with the same coloring results as the G0-linkednetworks in the fingerprint regions.

FIG. 6 depicts a region 600A of an exemplary circuit layout 600 showinga plurality of G0-linked networks that have been colored according tothe exemplary coloring methods of the present disclosure. The region600A of the circuit layout 600 has a first set of lines (collectivelyshown as 602) representing metal lines in various lengths and a secondset of lines (collectively shown as 604) representing metal lines invarious lengths. The first set of lines 602 have been assigned to afirst photomask (represented by color gray) and the second set of lines604 have been assigned to a second photomask (represented by colorwhite). The region 600A of the circuit layout 600 also has a pluralityof squares (collectively shown as 606) representing vias. The metallines may be disposed at a different layer above and/or underneath thevias in an IC. The squares 606 having G0-spaces are linked andidentified as G0-linked networks, of which only 608, 610, 612, 614, 616,and 618 are shown for illustration purposes.

As can be seen, each of the G0-linked networks have been colored (i.e.,assigned to different photomasks) using the coloring methods discussedabove with respect to FIGS. 2A-5D. In one implementation, one or moreG0-linked networks and their unique coloring combinations shown in theregion 600A may be stored in the machine readable storage medium andused as a fingerprint to identify/assign a unique coloring combinationto identical/similar G0-linked networks appeared in a different circuitlayout or different regions of the same circuit layout. For example, theEDA tool may find the region 700A of a circuit layout 700 (FIG. 7A)having identical G0-linked networks matched the region 600A. Therefore,the EDA tool can instantly assign coloring combinations associated withthe region 600A to the G0-linked networks appearing in the region 700Aso that the G0-linked networks in the region 700A have identicalcoloring combinations to the region 600A. The EDA tool may continue toapply the coloring methods to the rest of G0-linked networks in theregion 700B of the circuit layout 700. FIG. 7B depicts the G0-linkednetworks have been colored after the photomask assignment. The coloringfingerprint database therefore allows instant and consistent coloringresults in recurring G0-linked networks for DPT-compliant layoutdesigns.

FIG. 8 depicts a system 800 that may be used to practice variousimplementations of the present disclosure. The system 800 includes adesign rule checker (DRC) 802 that can check a circuit layout incomputer aided design format from a design database 804. The DRC 802identifies all G0-linked networks having a G0-space according to designrules, for example a spacing rule, as described at operation 304 of FIG.3 . The system 800 also includes an electronic design automation (EDA)tool 806 and a storage media 808 that is provided to store input dataused by the EDA tool 806. The EDA tool 806 receives data from DRC 802,such as data showing all G0-linked networks or G0-spaces in the circuitlayout.

The storage medium 808 may be a non-transient computer readable storagemedium such as dynamic random access memory (RAM), SDRAM, a read onlymemory (ROM), EEPROM, a hard disk drive (HDD), an optical disk drive(CD-ROM, DVD-ROM or BD-ROM), or a flash memory, or the like. The inputdata may include data from a coloring fingerprint database 810 thatstores one or more unique coloring combination (i.e., photomaskassignment) associated with the G0-linked networks, as described abovewith respect to FIGS. 6, 7A and 7B. The input data may also include datafrom program instructions 812 that have design information or designrules for executing various instructions. For example, the programinstructions may include instructions for changing odd-cycle loops foundin non DPT-compliant layout designs (e.g., the total number of G0-spacesviolating the minimum spacing requirements is an odd number) toeven-cycle loops.

The EDA tool 806 may be a special purpose computer used to perform acoordinate-based coloring method and decomposition process as discussedabove with respect to FIGS. 2A, 2B and 3 on G0-linked networksidentified by the DRC 802. The system 800 further includes a photomaskassignment tool 814 for assigning photomasks to colored G0-linkednetworks. The photomask assignment tool 814 outputs the photomaskassignment data 816 to a non-transitory machine readable storage medium818 for use by a lithography process, as discussed at operation 310 ofFIG. 3 .

Implementations of the present disclosure provide novel coloring methodsthat sort and pre-color nodes of G0-linked networks in a DPT-compliantlayout design by coordinate. By designating color to the node in eachG0-linked network based on “lowest X coordinate first then lowest Ycoordinate” rule, an EDA layout tool or any suitable automated tool isguaranteed to generate consistent coloring combinations for anyG0-linked networks in DPT-compliant layout designs even if they arelocated at different areas of the layout design or separated by otherdissimilar G0-linked networks. Particularly, all G0-linked networks in aDPT-compliant layout design will have unique and consistent coloringresults no matter what database is adapted by clients/chip designers orhow many design changes have been made, or are going to be made in thelayout design. Unique coloring combinations will remain consistentregardless of which area or which layer(s) in the IC is analyzed.Furthermore, G0-linked networks having a unique coloring combination canbe used to construct a coloring fingerprint database for instantassignment of photomasks for recurring G0-linked networks. The inventivecoloring method and coloring fingerprint database can minimize anyprocess issues that could otherwise occur due to inconsistencies incoloring results during the decomposition process. As a result, anyuncertainty in the manufacture of semiconductor devices is avoided.

In one embodiment, a method includes identifying target networks in acircuit layout, each target network having two or more linked nodesrepresenting circuit patterns, and each target network being presentedin an imaginary X-Y coordinate plane, assigning a first feature to afirst node in each target network, the first node is determined using acoordinate-based method, and assigning the first feature and a secondfeature to remaining nodes in each target network in an alternatingmanner so that any two immediately adjacent linked nodes in each targetnetwork have different features.

In another embodiment, a method includes receiving a multiple-patterningtechnology (MPT)-compliant circuit layout having a plurality of nodes,each node representing a circuit pattern, identifying nodes beingseparated by a distance less than a minimum separation distance astarget networks, the target networks being presented in an imaginary X-Ycoordinate plane, using a coordinate-based method to identify a firstnode in each target network, assigning a first color to the first nodein each target network, and assigning the first color and a second colorto remaining nodes in the target networks in an alternating manner sothat any two immediately adjacent nodes in each target network havedifferent colors.

In yet another embodiment, a system includes a design rule checkerconfigured to check a circuit layout and identify G0-linked networks inthe circuit layout having a G0-space, each G0-linked network having twoor more linked nodes representing circuit patterns, and a computerconfigured to receive data from the design rule checker to identify afirst node in each G0-linked network using a coordinate-based coloringmethod, each G0-linked network being presented in an imaginary X-Ycoordinate plane in the computer, assign a first color to the identifiedfirst node in each G0-linked network, and assign the first color and asecond color to remaining nodes in each G0-linked network in analternating manner so that any two immediately adjacent linked nodes ineach G0-linked network have different colors.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method of manufacturing a photomask,comprising: receiving a circuit layout; identifying target networks inthe circuit layout, each of the target networks having two or morelinked nodes representing circuit patterns, each of the target networksbeing presented in an imaginary X-Y coordinate plane; determining astarting node in each of the target networks using a coordinate-basedmethod; assigning a first feature to the starting node as a first nodein each of the target networks and assigning the first feature and asecond feature to remaining nodes in each target network so that any twoimmediately adjacent linked nodes in each target network have differentfeatures; outputting mask data based on the first feature and the secondfeature; and manufacturing one or more photomasks based on the maskdata.
 2. The method of claim 1, wherein the assigning the first featureand the second feature comprises a coordinate-based method including:(i) assigning the first feature to the first node in each of the targetnetworks; (ii) assigning the first node assigned with the first featureto a first photomask; (iii) assigning the second feature to a secondnode in each of the target networks; (iv) assign the second nodeassigned with the second feature to a second photomask; repeat (ii)-(iv)to remaining nodes in each of the target networks until any twoimmediately adjacent linked nodes in the target network have differentfeatures.
 3. The method of claim 1, wherein a distance between any twoimmediately adjacent linked nodes in each of the target networks is lessthan a minimum separation distance.
 4. The method of claim 2, whereinthe minimum separation distance is about 70 nm to about 120 nm.
 5. Themethod of claim 1, wherein the first node has a lowest X coordinate anda lowest Y coordinate.
 6. The method of claim 1, wherein the first nodehas a lowest X coordinate and a largest Y coordinate.
 7. The method ofclaim 1, wherein the first node has a largest X coordinate and a lowestY coordinate.
 8. The method of claim 1, wherein the first node has alargest X coordinate and a largest Y coordinate.
 9. A method ofmanufacturing a photomask, comprising: receiving a multiple-patterningtechnology (MPT)-compliant circuit layout having a plurality of nodes,each node representing a circuit pattern; assigning a number to ananalysis counter; identifying nodes being separated by a distance lessthan a minimum separation distance as target networks, the targetnetworks being presented in an imaginary X-Y coordinate plane;identifying a first node in each target network using a coordinate-basedmethod; assigning a first color to the first node in each targetnetwork; assigning the first color and a second color to remaining nodesin the target networks in an alternating manner so that any twoimmediately adjacent nodes in the target network have different colors;updating the analysis counter; analyzing the MPT-compliant circuitlayout based on the analysis counter; outputting mask data based on thefirst color and the second color; and manufacturing one or morephotomasks based on the mask data.
 10. The method of claim 9, whereinthe minimum separation distance is about 70 nm to about 120 nm.
 11. Themethod of claim 9, wherein the first node has a lowest X coordinate anda lowest Y coordinate.
 12. The method of claim 9, wherein the first nodehas a lowest X coordinate and a largest Y coordinate.
 13. The method ofclaim 9, wherein the first node has a largest X coordinate and a lowestY coordinate.
 14. The method of claim 9, wherein the first node has alargest X coordinate and a largest Y coordinate.
 15. The method of claim9, further comprising storing one or more target networks having aunique coloring combination in a storage medium; identifying networks ina different circuit layout or different regions of the same circuitlayout having an arrangement of nodes identical or similar to the storedtarget networks; and assigning the unique coloring combination to theidentified networks.
 16. A method of manufacturing a photomask,comprising: receiving circuit data from a design rule checker; assigninga number to an analysis counter; identifying a first node in a G0-linkednetwork using a coordinate-based method, the G0-linked network beingpresented in an imaginary X-Y coordinate plane in the computer;assigning a first feature to the identified first node in the G0-linkednetwork; and assigning the first feature and a second feature toremaining nodes in the G0-linked network in an alternating manner,updating the analysis counter until any two immediately adjacent linkednodes in a target network have different features, analyzing the designrule checker based on the analysis counter; outputting mask data basedon the first feature and the second feature; and manufacturing one ormore photomasks based on the mask data.
 17. The method of claim 16,comprising checking a circuit layout and identifying the G0-linkednetworks having two or more linked nodes representing circuit patternsin the circuit layout.
 18. The method of claim 16, wherein the first andsecond features are selected from the group consisting of colors,shapes, numbers, icons, and symbols.
 19. The method of claim 16, furthercomprising: assigning first and second photomasks to nodes assigned withthe first feature and the second feature, respectively; and storinginput data used by the computer, the input data comprising one or moreG0-linked networks having a coloring combination unique to the one ormore G0-linked networks.
 20. The method of claim 16, wherein thecoordinate-based method identifies a first node having a lowest Xcoordinate and a lowest Y coordinate, a lowest X coordinate and alargest Y coordinate, a largest X coordinate and a lowest Y coordinate,or a largest X coordinate and a largest Y coordinate.